(1) New breakthroughs in "amorphous" technology. The high alloying of the solder prevents certain solders from being processed into wires or ribbons in a conventional manner, which limits the scope of application of these solders. In the mid-1970s, "amorphous" technology was applied from industrial laboratories to industrially developed countries, opening up new processing methods for solders that cannot be formed by conventional methods.

 

China only started research in the mid-1970s. From the first National Amorphous Materials Symposium held in 1978 to the mid-1980s, about 7 years later, China applied amorphous solder to production. In recent years, the winding technology has made breakthroughs, and it has small and medium batch production capacity. It can produce foil strips with a width of 100mm and a thickness of 0.03 to 0.05mm. At present, there are more than 30 types of brittle solders in the five main categories of nickel-based, copper-based, copper-phosphorus, aluminum-based, and tin-lead that can be produced by "amorphous" technology. Harbin Welding Research Institute successfully made Ag-Cu-A1 series medium temperature aluminum solder into a thin strip of 0.1 ~ 0.2 × 20mm for brazing aluminum and aluminum and PTC ceramics.

 

(2) Successful development of tape solder Tape solder is another processing method for processing some solder powders that cannot be processed into tape by conventional methods. This technology has been successfully developed in China. By selecting new adhesives and improving manufacturing processes, adhesion and warranty periods have been increased. Particularly suitable for large area brazing of nickel-based high temperature solder.

 

(3) Cu-P series solders have made breakthroughs in processing and forming technology. Although Cu-P series solders have good soldering process performance, they are very brittle at room temperature. Inconvenience caused by welding work. After years of research, in the mid-1980s, it has been made into a metal wire of ф0.5. At present, this processing technology has gradually matured, and many solder manufacturers can produce Cu-P series welding wires. This breakthrough in processing technology has broadened the market for the application of Cu-P series solders.

 

 

 

(4) Many results have been obtained in the research and production of paste solder. In recent years, many units have successfully developed solder pastes for SMT technology and solder pastes for soldering, and a small number of products have been used. market. The market prospects in this field will also be very broad, because whether it is a large number of mobile phones, computers or refrigeration parts industries, solder paste is used in large quantities, and many solder pastes are currently imported from abroad.

 

3. Development of brazing process and equipment

 

(1) Arc brazing; (2) Transient liquid phase brazing; (3) Infrared brazing; (4) Vacuum brazing; (5) DC resistance brazing; (6) Diffusion brazing; (7) High Frequency brazing; (8) microelectronics brazing (laser brazing, reflow and

 

Wave soldering); (9) Brazing automation.

 

4 Conclusion

 

With the rapid development of welding technology, brazing and diffusion welding have become one of the most widely used connection technologies. With the continuous development of home appliance industry, microelectronics industry and communication industry, the research of brazing and diffusion welding technology will enter a new development period, especially the development of brazing materials will face a new development opportunity.

Brass Brazing Alloy